RUNNING PROJECTS

EUR 06-103 CANOPY - CArbon NanOtubes/ePoxY composites (doc)

CANOPY project aims at the development of high performances carbon nanotubes/epoxy adhesives for boards assembly and die attach applications. The objective is to take benefit of carbon nanotubes (CNT) promising properties to develop new composites with improved electrical and thermo-mechanical characteristics (in particular high thermal conductivity) with respect to traditional epoxy adhesives currently used in microelectronics industry.

Kick-Off meeting: 02/04/2008

Partners : France & Poland

Budget : 1,58 M euros

EUR 06-104 IMATERA - IMAging in the TERAhertz domain

IMATERA goal is to design, manufacture and characterize a focal plane array, and to demonstrate its ability in producing Terahertz (THz) images at room temperature. This will be realized through the integration and miniaturization of dedicated antennas for THz sensing. This sensor will allow us to build up a THz camera set-up for multi-purpose applications in the following domains: concealed weapons detection for public security, medical imaging, landmine detection and airplane security, chemical detection in atmosphere pollution context.

Kick-Off meeting: 20/09/2007

Partners : France / Germany / Sweden & Italy

Budget : 3,37 M euros

EUR 06-105 IMICIMO - Integrated Miniature Circulators for microwave Modules

This project aims at developing new materials and manufacturing technologies for microwave ferrite components: circulators and isolators that will enable for reduction of the device size, weight and cost, and will therefore facilitate their integration and packaging in mobile telecommunication equipment of the new generation.

Current microwave ferrite components are bulky and difficult to integrate with other components employed in the Systems in Package because they are generally not presented as chip components and manufactured as standalone ferrite devices. Therefore microwave Transmit/Receive modules used in radars and telecom applications tend to avoid their use by replacing them with other solutions: diodes, MEMS etc.

Kick-Off meeting: 07/03/2008

Partners : : France / Hungary / Slovenia & Poland

Budget : 6,15 M euros

EUR 06-106 DISCO - Dense Integration of Secured Communication + lien :

DISCO goal is to develop a communication module able to manage several civil existing protocols of short-range wireless communication like Wi-Fi, Bluetooth™, ZigBee, and Radiofrequency Identification (RFID), together with others now appearing on the stage, like WiMAX or UWB, in order to provide flexible and low cost solutions with respect to applications and scenarii of use.

This module would be able to be part of a communication network and the communicating items should be handheld and portable terminals, PC‘s, sensors, and other electronic devices.

Special care needs to be taken on flexible connectivity including new concepts of smart antennas in terms of technology and bandwidth.

Communication has to be: secure, reliab

Kick-Off meeting: 13/03/2007

Partners : : France / Italy & Portugal

Budget : 6,15 M euros

EUR 06-108 IPITECH - Innovative PCB Integration Technologies for HDI board in Harsh environment

The original goal of IPITECH is to take advantage and adapt for harsh environment from the last ones in development for portable consumer electronics. The common trend towards smaller and more powerful products causes great efforts in the whole electronic industry. For high end electronic equipment manufacturers the challenge is to introduce these very high dense technologies facing the reliability issue with low possession cost.

The second goal, due to increasing clock speed and high data transfer rates, is the treatment of parasitic effects in the design process. A Codesign flow for high frequency, high data rate and high pin counts systems will be studied and implemented. Signal integrity and functional verification will follow as soon as the layout is done. Automated Signal integrity tools for comprehensive and complete verification such as, SpectraQuest-Cadence or other tools can be used to speed up the analysis. Detailed analysis using spice simulator and parasitic extraction tools may be necessary for clock traces.

Kick-Off meeting: 17/12/2007

Partners : : France & Belgium

Budget : 4,22 M euros

EUR 06-109 LAFMOT - Luneberg Antenna For Multimedia On Train

LAFMOT aims at the development and realization of a new technology for compact directive antenna with an automatic tracking of the satellite over a large angular sector without any performance degradation. The Multilayered Luneberg Lens based on association of several layers of different density foams combined with a conformable RF source movable along the outer surface offers very good performances in term of gain and beam scanning. The lens will be provided with a feed antenna which provides optimum performance of the antenna system, both at L- and Ku-band. Both lens and RF source can be realized with foam with a specific metallization for source radiation and via holes for feeding or to add reactive loadings. As a matter of fact many antennas today need some conformability and exhibit also multilayered structure either to increase bandwidth, multifrequency property or to focus EM energy. This means development of new materials such as conformable foams with controlled electric permeabilties, and development of new mecatronics devices including light and strong mechanical foam structures and the electronic control of tracking.

Kick-Off meeting: 11/06/2008

Partners : : France & Hungary

Budget : 1,51 M euros

EUR 06-110 CARUS - Carotid 3D high frame rate ultrasound scanner for advanced diagnosis of cardiovascular disease

CARUS project aims at the development of early predictive and advanced diagnosis technology for atherosclerosis in the carotid artery in response to the major health issues associated with cardiovascular diseases. The ultimate technological goal of the project is to develop an innovative high frame rate matrix ultrasound system for non-invasive real-time three-dimensional quantitative assessment of structural and functional vascular properties. The project is built as an intelligent combination of a high-density matrix sensor, integrated novel package of analog-digital imaging electronics, high frame rate 3D ultrasound beam forming and specialised 3D software.

Kick-Off meeting: 21/03/2007

Partners : : France & Netherlands

Budget : 4,63 M euros

EUR 06-112 FlexILVIA - Flexible Inlays in Large Volume for Identification Application

The main goal of the project is to develop flexible RFID inlays and associated reel-to-reel processes compatible with a high volume production. The RFID inlays are made of flexible substrates on which small silicon chips are assembled by flip-chip.

This project therefore aims at designing, manufacturing and packaging flexible antennae to be used in contactless object identification and tracking systems exploiting radio frequency identification technologies at short to medium distances.

Kick-Off meeting: 02/07/2007

Partners : : France / Austria / Spain & Netherlands

Budget : 4,63 M euros

EUR 06-114 RESTLES - REliable SysTem Level IintEgration of Stacked chips on MEMS + lien : RESTLES Poster

Since exploiting state of the art automotive qualified technologies is mostly at its zenith it is crucial to take the next steps towards outstanding new technologies to secure Europe's competitiveness. Introduction of innovative new technologies in automotive applications must be accompanied by the demonstration of their reliability and safety.

RESTLES will integrate serial technologies like silicon MEMS, wafer thinning, chip stacking and flip chip to one unique packaged chip stack at die scale (PCSDS). The inherent cross influence of the different materials on device performance and intelligent control mechanisms to eliminate these parasitic effects will be investigated.

Kick-Off meeting: 01/06/2007

Partners : : Germany & Finland

Budget : 14,17 M euros

EUR 07-301 CERAMJET - Ceramic electronic components by inkjet printing + lien :

CERAMJET has the goal to offer to the main actors of the ceramic interconnect & component makers of Europe a dramatic competitive advantage by using a revolutionary method for making their products. The CERAMJET targeted direct and immediate applicationsare :MLCCS (capacitors), fine line thick film circuitry, LTCC, HTCC, ceramic sensors or actuators (MEMS) system on ceramic (SOC).

Inkjey is now a very widely used method for office printers and is rapidly spreading into other industries.

CERAMIC INK JET IS “THE” RUPTURE TECHNOLOGY OVER ANY SCREEN PRINTER OR PEN WRITER.

Kick-Off meeting: 25/10/2007

Partners : : France / Austria & Belgium

Budget : 3,56 M euros

EUR 07-302 COSY- 3D- COmpact Secured sYstems in 3D

This project is built up in collaboration with industrial, research centres and academia to create an innovative, highly secure and portable intelligent system, that will facilitate, advanced telephony, multimedia, secure transactions, enterprise access (digital & physical). It can be considered as a logical continuation of the current Sm@rtPack PIDEA+ project, where one of the main axes of development is chip on wafer “Face Connected Die Stacking” and is at its running pilot phases.

COSY-3D project allows a huge evolution of the Sm@rtPack technology, enlarging the heterogeneous compact module through MEMS and passives in a 3 layers device vertically integrated and compatible to secure compact portable products.

Kick-Off meeting: 15/01/2008

Partners : : France / Austria / Spain & Finland

Budget : 9,39 M euros

EUR 07-303 FlexAd - Flexible conductive adhesive for substitution leadfree solders on PCB + lien :

This project aims to develop new conductive adhesives which fill all functional requirements of present day solder and are intended to be a substitute for lead-free solder. Existing lead-free solder for mounting automotive electronic components onto organic PCB presents both process and reliability issues. Lead-free solder reflow temperatures would require re-qualification or even re-design of existing electronic components, not developed for these process temperatures during PCB assembly. In addition, lead-free solders have poor elastic properties compared to lead-based solders and therefore present reliability problems as a result of thermomechanical deformations. Existing Ag-filled conductive adhesives are prohibitively expensive, cannot accommodate for the thermal expansion coefficient mismatch between the Si component and the organic PCB, and cause oxidation on the Sn-coated component pins.

Kick-Off meeting: soon

Partners : : France & Spain

Budget : 4,72 M euros

EUR 07-305 MIDASS - Moulded Interconnect Device Applied to Smart Systems + lien

This project targets the development of new technological solutions for the realization of innovative plastic components and interconnections for high frequency mobile and embedded applications such as communications, aeronautics, automotive...

As a proof of concept, the previous technological concept will be applied to the development of innovative functions integrating electronics and mechanics on one-piece components and to be integrated in high performances communication equipments dedicated to professional and secure networks such as:

- Broadband networks as WiFi, WiMax, UWB, ...

- Narrow-band and wide-band networks for PMR (Professional Mobile Radio communication)

Kick-Off meeting: 16/01/2008

Partners : : France / Luxembourg & Spain

Budget : 10,22 M euros

EUR 07-408 IQ FUEL- Integrated sensor for determining Quality of FUEL+ lien :

The main goal of this new project is to develop a novel system approach comprising of a miniaturized and cost-optimized sensor device and the associated engine management system functionalities, which using the output signals of the sensor device will allow to adapt the engine control strategies and parameters in function of the fuel that is actually being used so to reach proper emission levels and optimum fuel consumption. The miniaturized sensor device will be developed into a micro system. The engine management system functionality will be integrated into an existing Engine Control Unit, so to allow for on-vehicle testing. Both parts of this novel system approach will be developed, prototyped and validated on engine test bench and on vehicle by measuring the emission levels and the associated fuel consumption with different types of fuels. Finally, the approach will be compared to standard, existing engine management systems

Kick-Off meeting:

Partners : : France & Finland

Budget : 8,11 M euros

EUR 09-702 3DICE - 3D Integration of Chips using Embedding technologies

The endless race of miniaturization and integration of nomadic devices leads the semiconductor Industry to always propose new solutions for device integration. The More than Moore approach is one of the mega-trend which will offer tremendous opportunities to solve the cost / integration / performances trade-offs. One key architecture enabling further miniaturization is the 3D Die embedded in Die (DeD) integration which is a way to insert an ultra thin die into the interconnections layers of a mother die.

3DICE project targets the development of technological bricks for embedding dice into organic or silicon substrates, with single or multi layer configurations, in order to perform unprecedented smart system integration at wafer level for industrial high volume manufacturing. Some bricks will be common to the different substrates and some others will be specific. The validation of the bricks

will be achieved by building 2 functional demonstrators addressing Telecom and Smart card applications.

Kick-Off meeting: 15/10/2009

Partners : : France / Austria / Germany & Sweden

Budget : 11,50 M euros