EUREKA Initiative for Packaging & Integration of µDevices & Smart Electronic Systems

EURIPIDES² is a EUREKA Cluster promoting the generation of innovative, industry-driven, pre-competitive R&D projects in the area of Smart Electronic Systems.

EURIPIDES² operates in an open community of large industry, SMEs, universities, research institutes and user organisations, along the Electronic Components and Systems value chain. EURIPIDES² facilitates access to national funding in Europe and beyond. As a EUREKA Cluster, the network is open to participants worldwide.

EURIPIDES² covers the whole electronic systems integration value chain, from materials, equipment and technologies, components and modules, up to embedded, enmeshed and implanted systems. These activities involve about 1.7 million employees in Europe, out of the 2.5 million employed in all the European electronics industry.

19 EUREKA member/partner/associated countries (Belgium, Czech Republic, Canada, Estonia, Finland, France, Germany, Hungary, Ireland, Israel, Norway, Monaco, Poland, Romania, South Korea, Spain, Sweden, Switzerland and Turkey) have given their approval of this new program dedicated to smart electronic systems. EURIPIDES² will run until June 2021.


  • Smart Electronic Systems
  • Smart Systems Integration from components to systems: heterogeneous, physical and functional integration, consideration of thermal, mechanical, electrical, optical, electromagnetic compatibility and reliability characteristics, packaging and interconnection, testing, validation and industrialisation
  • Integrated Micro- and Nano systems
  • Industrialization and manufacturability of systems, integration of hardware, software and energy storage


Application areas:

  • Transport & Mobility
  • Electric mobility
  • Autonomous transport
  • Health & well-being
  • Manufacturing / Factory Automation
  • Digital industry
  • Telecom and interconnection system
  • Energy
  • Aerospace
  • Smart Systems for the Environment
  • IoT
  • Wearables



Running Calls

  • November 25, 2020 Call Launch
  • February 26, 2021 Closing Date for PO Submission
  • March 30, 2021 TEC Consensus meeting

Success stories


European equipment suppliers benefit from smart analysis methods for 3D integration in advanced microsystems and materials [SAM3]

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