Projects are the core business of EURIPIDES². The EURIPIDES² Board is granting the label twice a year. 84 projects worth 461 million Euros in R&D have been labelled under EURIPIDES and EURIPIDES² (2007-2016). All running and finished projects are listed below.
12-1310 UPMOST Ultrafast laser Processing for MObile diSplay TechnologyFinished
03-Sep-201201-Sep-201536 months€ 2,57 Million
France: 43,5 % South Korea: 40,9 % Belgium: 15,6 %
The project is devoted to the development of ultrafast laser processing for advanced mobile displays. The objective is to develop a non-thermal, ultra precision machining process using femtosecond lasers and novel optical systems for beam shaping and pulse shaping. The objective is to provide a fully customised fabrication means for high resolution mobile displays as submicron precision is required as the pixel size of such HD displays decreases.
12-1309 SICRATES SiC Rectifier bridge Assembly for aeronautics in high Temperature harsh EnvironmentsFinished
21-Jan-201421-May-201740 months€ 3,04 Million
France: 71,5 % Sweden: 28,5 %
The objective of this program is to develop new assembly processes compatible with SiC components in order to propose demonstrators compatible with high temperature.
12-1307 LAMA LAser diode Modules for high performance caesium Atomic Finished
01-Jan-201405-Jul-201741 months€ 2,96 Million
France: 65,9 % Switzerland: 34,1 %
Time frequency applications require reliable, high precision, high stability, compact and cost effective clocks. Cesium atomic clocks are currently considered as the most suitable devices complying with such requirements. The objective of LAMA is to develop of highly reliable and cost effective laser diode modules: this is one of the most challenging part of atomic clocks and the key to achieve a complete European supply chain in this field.
11-127 LOCCIMIM Low Cost Circulators For Microwave ModulesFinished
03-Oct-201303-Oct-201736 months€ 6,24 Million
France: 61,54 % Spain: 25,64 % Germany: 12,82 %
LOCCIMIM aims at the development of a new generation of low size and low cost ferrite circulators made by LTCC (Low Temperature Co-fired Ceramics) for telecommunication applications.
The purpose of the project is to bring an established additive, tool-less, fully digital and contactless inkjet technology, demonstrated as scientifically leading and fully proven with ceramic and organo metallics, all the way to a production-ready stage, of high throughput enabled rupture capability geared towards large area printed electronics applications.
11-111 SATPACK Novel Satellite Application, IC And Module PackagingFinished
01-Feb-201231-Dec-201546 months€ 2.30 Million
France: 58 % Germany: 42 %
Design, test and evaluation according to space environment requirements, of the next generation of integrated circuits or hermetic module packaging for satellite applications.
10-101 BOB Board On Board TechnologyFinished
01-Dec-201130-Dec-201549 months€ 5,4 Million
France: 55 % Austria: 24,9 % Spain: 20,1 %
BoB project relies on innovative solution, which consists of splitting the PCB board in 2 thinner PCBs which are interconnected with a very high dense flexible circuit and through pins. Each thin board will use IPITECH technology (stacked and copper filled microvias).
09-803 THOR Striking Technologies For Power Finished
01-Oct-201030-Mar-201436 months€ 32,6 Million
France: 60 % The Netherlands: 40 %
The EURIPIDES-CATRENE co-labelled THOR project is developing highly efficient, integrated and reliable power electronics technologies offering new applications and increasing the competitiveness of major European industries in automotive, aeronautics and healthcare applications. The project aims to exploit new technologies for discrete power components, power cores and storage elements - currently one of the most promising areas of electronics - while improving the robustness and reliability of high power electronics systems and facilitating their miniaturisation.
THOR has been presented during the EURIPIDES 2012 Forum of Graz.
09-801 COSEC ID Colour Secure Photo On Id Documents And Id CardsFinished
28-Apr-201028-Apr-201336 months€ 5,46 Million
Ireland: 6 % France: 59 % Finland: 35 %
COlour SECure photo on ID documents and ID cards with enhanced global security through colour "guillochés", robust ID image hashing, watermarking, and interlinking of graphical data with the enclosed chip-related information.
09-710 AcousticNose Compact Photo-Acoustic Mid-Infrared Spectroscopy Sensor for Extended Range of Chemical AgentsFINISHED
01-Sep-201001-Sep-201224 months€ 1,54 millions
France: 61,69 % Norway: 38,31 %
The project has two main research objectives, both of them equally important to achieve the main goals for the project. Photo-acoustic spectroscopy (PAS) in combination with quantum cascade lasers (QCL) allows highly compact and extremely sensitive gas sensor systems to be built. The main objective of the project AcousticNose is the miniaturization of such a system by extensive use of photonic and microsystemsn technology.
09-708 SINETRA Smart Integration For Rescue Teams Finished
01-Mar-201001-Mar-201336 months€ 8,13 Million
France: 64 % Germany: 19 % Spain: 17 %
The SINETRA System is dedicated to Public Safety organizations (first responder, fireman, policeman, rescuer) operating outdoor and indoor. The first responder is equipped with sensors which measure information such as his location (indoor and outdoor), his health parameters and environment
parameters. After local processing, data are uploaded to the Mobile Command Centre, displayed to the First Responder himself and stored for after crisis management. The SINETRA System is embedded in the suit of the user, it is an industrial proof of the so-called wearable PMR concept.
SINETRA was presented during the EURIPIDES 2012 Forum of Graz.
The project aims to design and prototype a very innovative integrated smart sensor devoted to
improve the capabilities of autonomous systems (security systems, personal services robots,
intelligent cars, ...). It will be based on visual environment sensing coupled with inertial
sensors and navigation functions.
09-702 3DICE 3D Integrated Of Chips Using Embedding Technologies Finished
01-Oct-200901-Apr-201342 months€ 11,50 Million
France: 73,3 % Austria: 16,4 % Germany: 10,3 %
3DICE project targets the development of technological bricks for embedding dice into organic or silicon substrates, with single or multi layer configurations, in order to perform unprecedented smart system integration at wafer level for industrial high volume manufacturing.
09-701 IDEATA Innovative Design Architecture For Thin Electronic Steering AntennasFinished
04-Apr-201106-Oct-201443 months€ 4,27 Million
France: 58 % Spain: 23 % Hungary: 19 %
The IDEATA project aims at the development of a new phased array antenna architecture concept based on low cost technologies. Relying on previous EURIPIDES-EUREKA projects results, developments of innovative packaging and interconnection technologies should lead to the design of new phased array antennas able to fulfil all current and future X to Ku Band specifications. The proposed project aims at the development and the demonstration of such a solution.
07-411 KEENATON High Secured Ais Transceiver For Maritime Oil Rigs Signalisation. Automatic Identification System.Finished
01-Jan-200901-Jan-201248 months€ 3,81 Million
France: 50 % The Netherlands: 25 % Ireland: 25 %
The project goal is to design and qualify new AIS equipment for the Aid to Navigation market.
07-408 IQFUEL Integrated Sensor For Determining Quality Of Fuel Finished
01-Feb-200801-Jan-201247 months€ 8,64 Million
France: 63 % Germany: 6 % Finland: 31 %
IQ FUEL will develop a highly integrated micro sensor system that determines the actual fuel composition in the tank In addition the new Fuel Quality Sensor can detect problematic substances in the fuel, such as sulfur, water within gasoline, additives, or other contaminants.
07-305 MIDASS Moulded Interconnect Device Applied To Smart Systems Finished
16-Jan-200816-Jul-201030 months€ 10,22 Million
France: 75 % Spain: 25 %
This project targets the development of new technological solutions for the realization of innovative plastic components and interconnections for high frequency mobile and embedded applications such as communications, aeronautics and automotive.
COSY-3D was built up in collaboration with partners from industry, research centres and academia to create a structured 3D system which will enable the functions of memory, CPU, a stable MEMs or CMOS based oscillator, Passive components and some RF blocks to be integrated into the smallest possible footprint block. Targeted markets were: advanced telephony, multimedia, secure transactions.
07-301 CERAMJET Ceramic Electronic Components By Inkjet Printing Finished
14-Nov-200714-Apr-201141 months€ 3,33 Million
France: 68 % Belgium: 17 % Germany: 15 %
The results were very positive. Indeed, complex thick film circuits were printed and reached the same performances after sintering as screen printing (conductivity, sticking…). Multi-layered ceramic capacitors were shaped in a single stage of manufacturing and they were sintered without cracks or delamination. Finally, a new inkjet printer was introduced to the market and already released in more than 10 models for the ceramic industry, but also to the organic printing world, for the shaping OLEDs, organic photovoltaic or electronic circuits on flat and flexible substrates.
Intelligent and Integrated Micro-Systems (IMS) represent the next electronic evolutionary step for the simultaneous integration of sensing, processing, actuation and power management, in order to achieve advanced functions such as multi-spectral processing, real time data analysis and adaptability in response to a changing environment. The IMS will have to achieve autonomous and self-reconfigurable operations, for real-time and efficient self-optimization of their performance. MEGA project is aimed at bringing together advanced microwave functions using wide band gap (WBG) devices along with RF MEMS active interconnections.
06-204 TIMI Heat Dissipation Constraints In Highly Dissipative IcsFinished
17-Dec-200717-Aug-200920 months€ 1,76 Million
France: 60 % Germany: 40 %
TIMI project dramatically decreases the heat dissipation constraints in highly dissipative ICs, therein allowing easy customization at the upper level (above-IC) with memories, communication devices, sensors. This simple technology, based upon introducing a thermal barrier within the device interconnects, fulfils the major trend of the semiconductor industry of integrating multiple functionalities in 3D chips.
06-114 RESTLES Reliable System Level Integration Of Stackes Chips On Mems (Micro-Electro Mechanical System). Finished
20-Jul-200715-Jun-201148 months€ 14,17 Million
Germany: 56,21 % Finland: 43,79 %
The goals of the RESTLES project are:
Chip scale package integration of different microsystem technologies by thin die stacking, polymer embedding, redistribution wiring and UBM
Anisotropic Magneto-Resistive bridge on signal conditioning ASIC
Signal conditioning ASIC on MEMS inertial sensor element
The project aims at designing, manufacturing and packaging flexible antennae to be used in contactless object identification and tracking systems exploiting radio frequency identification technologies at short to medium distances.
06-110 CARUS Carotid 3d High Frame Rate Ultrasound Scanner For Advanced Diagnosis Of Cardiovascular Disease. Finished
02-Jan-200731-Mar-201039 months€ 4,04
The Netherlands: 61 % France: 39 %
The CARUS project aims at the development of early predictive and advanced diagnosis technology for atherosclerosis in the carotid artery in response to the major health issues associated with cardiovascular diseases. The ultimate technological goal of the project is to develop an innovative high frame rate matrix ultrasound system for non-invasive real-time threedimensional quantitative assessment of structural and functional vascular properties.
06-109 LAFMOT Luneberg Antenna For Multimedia On Train Finished
01-Mar-200702-Nov-200932 months€ 1,51 Million
France: 75 % Belgium: 25 %
LAFMOT objective is to offer permanent high speed internet connection for “high speed train” travellers and crew. Antennas will have to maintain a radio communication between a GEO satellite and the train. The main innovation proposed in LAFMOT is the foam half spherical Luneberg Lens with source, where any point on the surface is a focal point. The antenna and its source will be realized with conformable foam plus metallization.
06-108 IPITECH Innovative Pcb (Printed Circuit Board) Integration Technologies For Hdi Board In Harsh EnvironmentFinished
17-Dec-200717-Dec-201036 months€ 6,59 Million
France: 75 % Belgium: 25 %
The main goal of IPITECH is to be able introduce the very high dense technologies facing the reliability issue in harsh environment. The real important challenge is to mixe several important process steps of recent PCB technology to be able to design and manufacture attractive high end products. Ensure the fact that the specificities of the high end product will be satisfy.
06-106 DISCO Dense Integration Of Secured Communication Finished
01-Jan-200701-Jul-200930 months€ 4,79 Million
France: 55 % Italy: 31 % Portugal: 14 %
The project goal is to develop a communication module able to manage several existing protocols of short-range wireless communication in order to provide flexible and low cost solutions with respect to applications and scenarii of use.
06-105 IMICIMO Integrated Miniature Circulators For Microwave ModulesFinished
This project aims at developing new materials and manufacturing technologies for microwave ferrite components: circulators and isolators that will enable for reduction of the device size, weight and cost, and will therefore facilitate their integration and packaging in mobile telecommunication equipment of the new generation.